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- ccflags-$(CONFIG_USB_DWC3_DEBUG) := -DDEBUG
- ccflags-$(CONFIG_USB_DWC3_VERBOSE) += -DVERBOSE_DEBUG
- obj-$(CONFIG_USB_DWC3) += dwc3.o
- dwc3-y := core.o
- dwc3-y += host.o
- dwc3-y += gadget.o ep0.o
- ifneq ($(CONFIG_DEBUG_FS),)
- dwc3-y += debugfs.o
- endif
- ##
- # Platform-specific glue layers go here
- #
- # NOTICE: Make sure your glue layer doesn't depend on anything
- # which is arch-specific and that it compiles on all situations.
- #
- # We want to keep this requirement in order to be able to compile
- # the entire driver (with all its glue layers) on several architectures
- # and make sure it compiles fine. This will also help with allmodconfig
- # and allyesconfig builds.
- #
- # The only exception is the PCI glue layer, but that's only because
- # PCI doesn't provide nops if CONFIG_PCI isn't enabled.
- ##
- obj-$(CONFIG_USB_DWC3) += dwc3-omap.o
- ##
- # REVISIT Samsung Exynos platform needs the clk API which isn't
- # defined on all architectures. If we allow dwc3-exynos.c compile
- # always we will fail the linking phase on those architectures
- # which don't provide clk api implementation and that's unnaceptable.
- #
- # When Samsung's platform start supporting pm_runtime, this check
- # for HAVE_CLK should be removed.
- ##
- ifneq ($(CONFIG_HAVE_CLK),)
- obj-$(CONFIG_USB_DWC3) += dwc3-exynos.o
- endif
- ifneq ($(CONFIG_PCI),)
- obj-$(CONFIG_USB_DWC3) += dwc3-pci.o
- endif
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